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半导体器件的机械标准化.第4部分:半导体器件封装外形图类型的划分和编号系统.修改件1
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment 1
参考页数：29P.;A4
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半导体器件的机械标准化.第1部分:分立器件外形图的一般规则
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
参考页数：36P.;A4
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半导体器件.机械和气候试验方法.第26部分:静电放电敏感性(ESD)测试.人体模型(HBM)
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
参考页数：106P.;A4
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半导体器件的机械标准化 第4部分：半导体器件封装外形图类型的划分以及编号体系
Mechanical standardization of semiconductor components Part 4 Classification and coding system for package outlines of semiconductor components
参考页数：
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半导体器件的机械标准化 第1部分：半导体器件图形绘制
Mechanical standardization of semiconductor components Part 1 Preparation of drawings of semiconductor components
参考页数：
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半导体光电模块GH83型光耦合器详细规范
Semiconductor opto-electronic module Detail specification for type GH83 opto-couplers
参考页数：10P.;A4
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半导体光电模块GD83型PIN-FET光接收模块详细规范
Semiconductor opto-electronic module Detail specification for type GD83 PIN-FET opto-receiver module
参考页数：15P.;A4
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半导体光电模块GD82型PIN-FET光接收模块详细规范
Semiconductor opto-electronic module Detail specification for type GD82 PIN-FET opto-receiver module
参考页数：15P.;A4
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微波组件.WFH362型双平衡混频器详细规范
Microwave assembly.Detail specification for model WFH362 double balanced mixer
参考页数：9P.;A4
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半导体器件10keV低能X射线总剂量辐射试验方法
10keV X-ray total dose radiation testing method of semiconductor devices
参考页数：13P.;A4
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