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管壳额定开关用场效应晶体管 空白详细规范
Biank detail-specification for field-dffect transistors for case-rated swatching application
价格：￥0.00
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TES1系列温差电致冷组件总规范
General specification for TES1 thermoelectric cooling module
价格：￥0.00
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TEC1系列温差电致冷组件总规范
General specification for TEC1 thermoelectric cooling module
价格：￥0.00
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半导体分立器件.CS4856～CS4861型硅N沟道耗尽型场效应晶体管详细规范
Semiconductor discrete device.Detail specification for types CS4856～CS4861 silicon N-channel deplition mode field-effect transistor
价格：￥0.00
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半导体分立器件.CS6760和CS6762型硅N沟道增强型场效应晶体管详细规范
Semiconductor discrete device.Detail specification for type CS6760 and CS6762 silicon N-channel enhacement mode field-effect transistor
价格：￥5.00
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半导体分立器件.CS5114～CS5116型硅P沟道耗尽型场效应晶体管详细规范
Semiconductor discrete device.Detail specification for type CS5114～CS5116 silicon P-channel deplition mode field-effect transistor
价格：￥3.00
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半导体分立器件.3DA331硅微波功率晶体管详细规范
Semiconductor discrete devices.Detail specification for type 3DA331 Silicon microwave power transistor
价格：￥3.00
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半导体分立器件.3DA325型硅微波功率晶体管详细规范
Semiconductor discrete devices.Detail specification for type 3DA325 silicon microwave power transistor
价格：￥4.00
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军用温差电致冷组件最大致冷功率的试验方法
Test method for maximum cooling power of military thermoelectric cooling module
价格：￥0.00
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