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半导体装置.微电子机械装置.射频控制和选择所用的微电子机械系统(MEMS)声表面滤波器(BAW)和双工器
Semiconductor devices. Micro-electromechanical devices. MEMS BAW filter and duplexer for radio frequency control and selection
参考页数：34P;A4
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电子设备连接器.试验和测量.耐力测试.测试9a.机械操作
Connectors for electronic equipment - Tests and measurements - Endurance tests - Test 9a - Mechanical operation
参考页数：10P.;A4
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电子设备连接器.试验和测量.耐久试验.试验9e:周期性电流负载
Connectors for electronic equipment - Tests and measurements - Endurance tests - Test 9e - Current loading, cyclic
参考页数：10P.;A4
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电子设备用连接器.试验和测量.静荷载试验(固定连接器).试验8b.轴向静荷载
Connectors for electronic equipment. Tests and measurements. Static load tests (fixed connectors). Test 8b. Static load, axial
参考页数：12P.;A4
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电子设备连接器.试验和测量.总则.试验1c.电接合长度
Connectors for electronic equipment - Tests and measurements - General - Test 1c - Electrical engagement length
参考页数：10P.;A4
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电子设备用机电元件规范.基本试验规程和测量方法.第3部分:载流量试验
Specification for electromechanical components for electronic equipment: basic testing procedures and measuring methods - Current-carrying capacity tests
参考页数：8P.;A4
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电子设备用电机元件.基本试验程序和测量方法.试验20b.易燃试验.耐火性.第2节:试验20b.耐火性
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Test 20b - Flammability tests - Fireproofness - Section 2: Test 20b - Fireproofness
参考页数：14P.;A4
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电子设备机电组件.基本试验程序和测量方法.常规.试验1d.触点防护有效性
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - General - Test 1d - Contact protection effectiveness (scoop-proof)
参考页数：12P.;A4
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电子设备用机电元件.基本试验规程和测量方法.钎焊性试验. 试验12f:机械钎焊焊接过程中溶剂和清洗剂密封性
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Soldering tests - Test 12f - Sealing against flux and cleaning solvents in machine soldering
参考页数：14P.;A4
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电子设备用机电元件规范.基本试验规程和测量方法.第4部分:动态应力试验
Specification for electromechanical components for electronic equipment: basic testing procedures and measuring methods - Dynamic stress tests
参考页数：8P.;A4
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