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关于有害物质禁用指令的电子电气产品评价的技术文件.德文版本EN 50581-2012
Technical documentation for the assessment of electrical and electronic products with respect to the restriction of hazardous substances; German version EN 50581:2012
参考页数：16P.;A4
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半导体装置.微机电装置.第13部分:测量MEMS结构粘接强度的折弯和剪切试验方法(IEC 62047-13-2012).德文版本EN 62047-13-2012
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012); German version EN 62047-13:2012
参考页数：17P;A4
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半导体器件.微电机器件.第12部分:使用MEMS结构共振的薄膜材料的弯曲疲劳测试方法(IEC 62047-12-2011).德文版本EN 62047-12-2011
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011); German version EN 62047-12:2011
参考页数：31P;A4
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半导体器件.微型机电器件.第9部分:微机电系统硅片的硅片键合强度试验(IEC 62047-9-2011).德文版本 EN 62047-9-2011
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
参考页数：26P;A4
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半导体器件.微电机装置.第5部分:射频(RF)微电子机械系统(MEMS)开关(IEC 62047-5-2011).德文版本 EN 62047-5-2011
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches (IEC 62047-5:2011); German version EN 62047-5:2011
参考页数：37P;A4
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半导体器件.微电子机械器件.第10部分:MEMES材料微极压缩试验(IEC 62047-10-2011).德文版本 EN 62047-10-2011
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011
参考页数：13P;A4
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半导体器件.微电机器件.第7部分:射频控制与选择用MEMS BAW滤波器和双工器(IEC 62047-7-2011).德文版本 EN 62047-7-2011
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (IEC 62047-7:2011); German version EN 62047-7:2011
参考页数：30P;A4
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半导体设备.微机电设备.第8部分:薄膜拉伸性能测量用带弯曲试验方法(IEC 62047-8-2011).德文版 EN 62047-8-2011
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011); German version EN 62047-8:2011
参考页数：20P;A4
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半导体器件.微电机器件.第4部分:MEMS一般要求(IEC 62047-4-2008);德文版本EN 62047-4-2010
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010
参考页数：22P;A4
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半导体器件. 微电机设备. 第6部分: 薄膜材料的轴向疲劳试验方法（IEC 62047-6: 2009）; 德文版本EN 62047-6: 2010
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010
参考页数：17P;A4
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