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印制板显微刨切方法及要求
Test methods and requirements of microsection for printed circuit boards
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印制板外观和尺寸检验方法
Inspectionmethods of visual and dimensional for printed circuit boards
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高密度互连印制板设计要求
Design requirements for high density interconnect printed circuit boards
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金属基印制板性能规范
Performacespecification formetal base printed circuit boards
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无铅再流焊接通用工艺规范
General technological specification for lead-free reflow soldering
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印制板的数字形式描述
Printed board description in digital form
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裸基板电测试数据格式
Bare substrate electrical test data format
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PM24型接触件间距为1.905mm的印制电路插座连接器详细规范
Connectors, receptacal type PM24, for printed circuit(1.905mm spacing), detail specification for
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多层印制板质量分等标准
Grading standard of quality for multilayer printed board
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低压系统内设备的绝缘配合 第三部分:应用涂覆层达到印制板组装件的绝缘配合
Insulation coordination for equipment within low-voltage system Part 3: Use of coatings to achieve insulation coordination of printed board assemblies
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