|
印制板用阻焊剂
Solder resists for printed boards
价格：￥0.00
|
|
|
|
|
|
印制电路辅助文件 第3部分:照相底版指南
Auxiliary printed board information Part 3: Guidelines for artwork
价格：￥0.00
|
|
|
|
|
|
多层印制板 能力详细规范
Capability detail specification: Multilayer printed boards
价格：￥0.00
|
|
|
|
|
|
有金属化孔单双面印制板能力详细规范
Capability detail specification: single and double sided printed boards with plated-through holes
价格：￥0.00
|
|
|
|
|
|
无金属化孔单双面印制板能力详细规范
Capability detail specification: single and double sided printed boards with plain holes
价格：￥0.00
|
|
|
|
|
|
无金属化孔单双面碳膜印制板规范
Specification for single and double sided carbon-coated printed boards without interlayer connection
价格：￥0.00
|
|
|
|
|
|
|
|
多层印制板用粘结片预浸材料
Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
价格：￥0.00
|
|
|
|
|
|
印制板返修,修理和修改
Re-work,repair and revision of printed boards
价格：￥0.00
|
|
|
|
|
|
|
