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半导体器件的机械标准化.第6-4部分:绘制表面安装半导体器件封装外形图的一般规则.焊球网格陈列封装尺寸的测量方法 图绘制的一般规则.球状网格阵列（BGA）封装尺寸的测量方法
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
参考页数：22P.;A4
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半导体器件的机械标准化 第6-2部分：表面安装半导体器件封装外形图绘制的一般规则 1.5mm,1.27mm及1.00mm小螺距球状和柱状端封装的设计指南
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
参考页数：10P.;A4
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半导体器件的机械标准化 第6-5部分：表面安装半导体器件封装外形图绘制的一般规则 小螺距球状网格阵列（FBGA）的设计指南
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA)
参考页数：10P.;A4
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半导体器件的机械标准化 第6-8部分：表面安装半导体器件封装外形图绘制的一般规则 玻璃密封陶瓷四面扁平封装（G-QFP）的设计指南
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP)
参考页数：10P.;A4
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阴极射线管的外形图的准备及其部件、连接和量规
Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges
参考页数：30P.;A4
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压电器件.频率控制和选择用表面安装器件(SMD)外形图制备.总则
Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
参考页数：22P.;A4
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频率控制和选择用表面安装的压电器件.标准外形和终端引线的连接.第2部分:陶瓷封装(IEC 61837-2-2011+A1-2014); 德文版本EN 61837-2-2011+A1-2014
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011 + A1:2014); German version EN 61837-2:2011 + A1:2014
参考页数：90P.;A4
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半导体器件的机械标准化. 第6-22部分: 表面安装半导体器件封装轮廓图的一般制备规则. 硅细间距球栅格阵列和硅细间距栅格阵列半导体封装的设计指南(S-FBGA和S-FLGA) (IEC 60191-6-22-2012); 德文版本EN 60191-6-22-2013
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013
参考页数：18P.;A4
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半导体器件的机械标准化.第6-1部分:表面安装半导体器件封装外形图绘制的一般规则.鸥翅式引线终端的设计指南
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001
参考页数：10P.;A4
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半导体装置的机械标准化.第6-3部分:表面安装的半导体装置包装外廓图绘制一般规则.包装尺寸测量方法
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
参考页数：16P.;A4
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