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半导体器件的机械标准化 - 第6-22部分: 表面安装的半导体器件封装外形图绘制的一般规则 - 半导体封装的设计指南 - 硅质细间距球栅阵列和硅质细间距基板栅格阵列 (SFBGA和S-FLGA)
Mechanical standardization of semiconductor devices - Part 6-22 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (SFBGA and S-FLGA)
参考页数:21P;A4
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半导体器件的机械标准化. 第1部分: 离散期间轮廓图的通用制备规则
Mechanical standardization of semiconductor devices - Part 1: general rules for the preparation of outline drawings of discrete devices
参考页数:43P;A4
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频率控制和选择用表面安装的压电器件.标准外形和端头连接.第2部分:陶瓷外壳
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: ceramic enclosures
参考页数:89P;A4
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压电器件.频率控制和选择用表面安装设备(SMD)的外形图制备.总则
Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
参考页数:21P;A4
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半导体器件的机械标准化.第6-21部分:表面安装半导体器件封装的外形图绘制的一般规则.小型外壳封装(SOP)的封装尺寸规格用测量方法.
Mechanical standardization of semiconductor devices - Part 6-21 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP).
参考页数:17P;A4
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半导体器件的机械标准.第6部分:表面贴装半导体器件封装的外形图准备的一般规则.
Mechanical standardization of semiconductor devices - Part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages.
参考页数:43P;A4
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半导体装置的机械标准化.第6-12部分:表面安装半导体装置外形图绘制的一般规则.小节距栅极矩阵列的设计指南
Mechanical standardization of semiconductor devices - Part 6-12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA).
参考页数:23P;A4
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半导体装置的机械标准化.第6-20部分:表面安装的半导体器件封装外形图绘制的一般规则.小外形J-引线封装(SOJ)的封装尺寸规格测量方法.
Mechanical standardization of semiconductor devices - Part 6-20 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ).
参考页数:15P;A4
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