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半导体器件的机械标准化.第6-5部分:表面安装的半导体器件外形图纸制备的一般规则.小螺距刃片栅格排列的设计指南 (IEC 60191-6-5:2001); 德文版本 EN 60191-6-5:2001
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version EN 60191-6-5:2001
参考页数：11P.;A4
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阴极射线管及其部件、连接件和量规外形图绘制
Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges (IEC 60139:2000); German version EN 60139:2001
参考页数：32P.;A4
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半导体器件的机械标准化.第6-10部分:表面安装半导体器件封装外形图绘制的一般原则.P-VSON的尺寸
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON (IEC 60191-6-10:2003); German version EN 60191-6-10:2003
参考页数：13P.;A4
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半导体器件的机械标准化.第6-8部分:表面安装的半导体器件包外形图纸制备的一般规则.玻璃密封陶瓷方形扁平封装(G-GFP)的设计指南 (G-QFP) (IEC 60191-6-8:2001); 德文版本 EN 60191-6-8:2001
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001
参考页数：14P.;A4
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物理量的字母符号.第9部分:压电晶体等效电路符号
Letter symbols for physical quantities - Part 9: Symbols for equivalent circuits of piezoelectric crystals
参考页数：7P.;A4
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压电装置.频率控制和选择用表面安装装置(SMD)框图的制备.通用规则(IEC 61240-2012).德文版本EN 61240-2012
Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules (IEC 61240:2012); German version EN 61240:2012
参考页数：19P.;A4
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半导体器件的机械标准化.第6-12部分:表面安装半导体设备包的外形图制备用一般规则.细间距栅极阵列的设计指南(FLGA)(IEC 60191-6-12-2011).德国
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011
参考页数：20P;A4
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半导体器件的机械标准化.第6-17部分:表面安装半导体器件封装外形图绘制的一般规则.堆栈封装的设计指南.细间距球栅阵列和细间距基板栅格阵列(P-PFBGA和P-PFLGA)
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011
参考页数：29P.;A4
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半导体器件的机械标准化.第6-21部分:表面安装半导体器件封装外形图绘制的一般规则.小外形封装(SOJ)的封装尺寸规格测量方法(IEC 60191-6
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
参考页数：17P.;A4
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频率控制和选择用表面安装压电装置. 标准外形和端子引线连接. 第2部分：陶瓷外壳(IEC 49 / 1218 / CD:2017)
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1218/CD:2017)
参考页数：193P.;A4
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