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光电子学总装和包装工艺学
Optoelectronics Assembly and Packaging Technology
参考页数：176P.;A4
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将人体模型静电放电应力应用到封装的光电组件的程序
Procedure for Applying Human Body Model Electrostatic Discharge Stress to Packaged Optoelectronic Components
参考页数：
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纤维光学系统用半导体光电器件.第1部分:基本额定值及特性用规范模板
Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics
参考页数：66P.;A4
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光学放大器.试验方法.第1-3部分:光功率参数和增益参数.光功率计法
Optical amplifiers - Test methods - Part 1-3: Power and gain parameters - Optical power meter method
参考页数：33P.;A4
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半导体分立器件和集成电路 第5-2部分:光电子器件 基本额定值和特性
Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics
参考页数：51P.;A4
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半导体分立器件和集成电路 第5-1部分:光电子器件 总规范
Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General
参考页数：59P.;A4
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光学电路板.第1部分:总则
Optical circuit boards - Part 1: General
参考页数：45P;A4
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光电器件.第7部分:光电器件的测量用光谱错配修正的计算
Photovoltaic devices - Part 7: Computation of the spectral mismatch correction for measurements of photovoltaic devices
参考页数：22P;A4
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纤维光学有源元件和装置.可靠性标准.第2部分:激光模块的衰变
Fibre optic active components and devices - Reliability standards - Part 2: Laser module degradation
参考页数：31P.;A4
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半导体装置.分立装置.第5-5部分:光电子装置.光电耦合器
Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers
参考页数：104P;A4
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