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印制电路用镀铜热固层压板的标准规格
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
参考页数:5P.;A4
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印刷线路板用铜覆层热固层压材料的标准试验方法
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
参考页数:9P.;A4
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印刷线路板触点上存在杂质的标准试验方法
Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
参考页数:3P.;A4
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印制电路用镀铜热固层压板的标准规格
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
参考页数:5P.;A4
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印刷线路板用铜覆层热固层压材料的标准试验方法
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
参考页数:9P.;A4
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印刷线路板触点上存在杂质的标准试验方法
Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
参考页数:3P.;A4
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印刷技术 印刷品和印刷油墨 用滤光氙弧灯评定耐光性
Graphic technology - Prints and printing inks - Assessment of light fastness using filtered xenon arc light
参考页数:5P;A4
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