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TES1系列温差电致冷组件总规范
General specification for TES1 thermoelectric cooling module
参考页数：20P.;A4
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TEC1系列温差电致冷组件总规范
General specification for TEC1 thermoelectric cooling module
参考页数：20P.;A4
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温差电致冷组件型号命名方法
Designation system for thermoelectric refrigeration modules
参考页数：3P.;A4
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温差电致冷名词术语
Terms for thermoelectric refrigeration
参考页数：23P.;A4
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平面厚膜半导体气敏元件
Thick film metal oxide semiconductor gas sensors
参考页数：19P.;A4
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半导体器件. 微型机电装置. PDMS和玻璃之间的粘结强度的试验方法
Semiconductor devices. Micro-electromechanical devices. Test method of bonding strength between PDMS and glass
参考页数：18P.;A4
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半导体器件. 微型机电装置. 用于测量薄膜力学性能的胀形试验方法
Semiconductor devices. Micro-electromechanical devices. Bulge test method for measuring mechanical properties of thin films
参考页数：34P.;A4
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半导体器件. 微型机电装置. 用于测定MEMS薄膜晶片曲率剩余应力的试验方法和悬臂梁挠度法
Semiconductor devices. Micro-electromechanical devices. Test methods for determining residual stresses of MEMS films Wafer curvature and cantilever beam deflection methods
参考页数：18P.;A4
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半导体芯片产品. 对芯片用户和供应商的问卷调查
Semiconductor die products. Questionnaire for die users and suppliers
参考页数：42P.;A4
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半导体器件. 微型机电装置. 薄膜MEMS材料泊松比试验方法
Semiconductor devices. Micro-electromechanical devices. Test method for Poisson's ratio of thin film MEMS materials
参考页数：18P.;A4
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