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印制板和印制板组件. 设计和使用. 第5-3部分: 连接 (焊盘/焊点) 考虑. 两面带有翅形引线的部件
Printed boards and printed board assemblies - Design and use - Part 5-3 : attachment (land/joint) considerations - Components with gull-wing leads on two sides
参考页数：33P.;A4
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印制板和印制板组件. 设计和使用. 第5-4部分: 连接 (焊盘/焊点) 考虑. 两面带有J形引线的部件
Printed boards and printed board assemblies - Design and use - Part 5-4 : attachment (land/joint) consideration - Components with J leads on two sides
参考页数：19P.;A4
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印制板和印制板组件. 设计和使用. 第5-8部分: 连接 (焊盘/焊点) 考虑. 区域阵列部件 (BGA, FBGA, CGA, LGA)
Printed boards and printed board assemblies - Design and use - Part 5-8 : Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
参考页数：36P.;A4
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印制板和印制板组件. 设计和使用. 第5-5部分: 连接 (焊盘/焊点) 考虑. 四面带有翅形引线的部件
Printed boards and printed board assemblies - Design and use - Part 5-5 : Attachment (land/joint) considerations - Components with gull-wing leads on four sides
参考页数：49P.;A4
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表面安装技术. 第4部分: 湿度敏感器件的分类, 包装, 标记和处理
Surface mounting technology - Part 4 : classification, packaging, labelling and handling of moisture sensitive devices
参考页数：39P.;A4
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装置嵌入基体. 第1-1部分: 总规格. 试验方法
Device embedded substrate - Part 1-1 : generic specification - Test methods
参考页数：60P.;A4
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印制板和印制板组件. 设计和使用. 第7部分: CAD库构建用电子元件零方向
Printed board and printed board assemblies - Design and use - Part 7 : electronic component zero orientation for CAD library construction
参考页数：27P.;A4
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电子组装技术. 电子模块
Electronics assembly technology - Electronic modules
参考页数：20P.;A4
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环境试验.第2-69部分:试验.试验Te/Tc.采用湿平衡(力值测量)法的电子元件和印制板焊接性试验
Environmental testing - Part 2-69 : tests - Test Te/Tc : solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
参考页数：59P.;A4
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焊接电子组件的工艺质量要求.第5部分:焊接电子组件的重作、修改和修理
Workmanship requirements for soldered electronic assemblies - Part 5 : rework, modification and repair of soldered electronic assemblies.
参考页数：48P.;A4
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