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印刷电路板组件. 第2部分: 分规范. 表面安装焊接组件的要求
Printed board assemblies - Part 2 : sectional specification - Requirements for surface mount soldered assemblies
参考页数:31P.;A4
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采用熔融无铅钎焊合金的波峰焊设备的侵蚀试验方法. 第1部分: 未经表面处理的金属材料侵蚀试验方法
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1 : erosion test method for metal materials without surface processing
参考页数:21P.;A4
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电子组件用连接材料.第1-3部分:电子焊接用电子级钎焊合金及有焊剂和无焊剂的固体焊料用要求
Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications.
参考页数:13P;A4
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电子元件.总则.软焊元件用镀锡电线
Electronic components. General. Tinned wires for components for soft soldering.
参考页数:16P.;A4
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电子装配工艺.第3部分:焊接接缝环境和耐久性试验法选择指南
Electronics assembly technology - Part 3 : selection guidance of environmental and endurance test methods for solder joints.
参考页数:51P;A4
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散热器手册第1部分:热阻曲线集
Heat sink handbook Part 1:Thermal resistance curves
价格:¥0.00
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