|
电子组件用连接材料.第1-3部分:电子焊接用电子级钎焊合金及有焊剂和无焊剂的固体焊料的要求
Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications.
参考页数：16P.;A4
|
|
|
|
|
|
电子设备结构体的机械结构件研制的模数序列.第2部分:分规范.25mm设备结构体的接口协调尺寸.第1节:详细规范.箱和架的尺寸
Modular order for the development of mechanical structures for electronic equipment practices - Part 2 : sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Secion 1 : detail specification - Dimensions for cabinets and racks.
参考页数：14P;A4
|
|
|
|
|
|
电子设备构体的机械结构件研制用模块排序.第2部分:分规范.25mm设备构体的接口协调尺寸.第2节:辅助框架、底盘、底板、面板及插入件的尺寸
Modular order for the development of mechanical structures for electronic equipment practices - Part 2 : sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 2 : Detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units.
参考页数：36P.;A4
|
|
|
|
|
|
印刷电路板和印刷电路板组件.设计和使用. 第1-1部分:一般要求.电气组件不平度的考虑
Printed board and printed board assemblies. Design and use. Part 1-1 : generic requirements. Flatness considerations for electronic assemblies.
参考页数：15P.;A4
|
|
|
|
|
|
电气材料、互连结构和组件的试验方法.第2部分:互连结构用材料的试验方法
Test methods for electrical materials, interconnection structures and assemblies - Part 2 : Test method for materials for interconnection structures.
参考页数：65P.;A4
|
|
|
|
|
|
印刷电路板和印刷电路板组件.设计和使用.第1-2部分:一般要求.控制阻抗
Printed boards and printed board assemblies - Design and use - Part 1-2 : generic requirements - Controlled impedance.
参考页数：49P.;A4
|
|
|
|
|
|
电子组件用连接材料.第1-2部分:电子组件中高质量互连接件用焊剂的要求
Attachment materials for electronic assembly - Part 1-2 : requirements for soldering pastes for high-quality interconnects in electronics assembly
参考页数：28P.;A4
|
|
|
|
|
|
印刷电路板组件. 第1部分: 总规格. 使用表面安装和相关装配技术的焊接电气和电子组件的要求
Printed board assemblies - Part 1 : generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
参考页数：54P.;A4
|
|
|
|
|
|
表面安装技术. 表面安装焊接接缝的环境和耐久性试验方法. 第1-2部分: 剪切强度试验
Surface-mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2 : shear strength test
参考页数：23P.;A4
|
|
|
|
|
|
表面安装技术. 表面安装焊接接缝的环境和耐久性试验方法. 第1-1部分: 抗拉强度试验
Surface-mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1 : pull strength test
参考页数：22P.;A4
|
|
|
|
|
