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装置内埋基板. 指南. 测试元件组 (TEG)
Device embedded substrate. Guidelines. Test element groups (TEG)
参考页数：40P.;A4
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装置内埋基板. 指南. 设计指南
Device embedded substrate. Guidelines. Design guide
参考页数：28P.;A4
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环境试验.试验.试验Td.表面安装设备(SMD)的可焊性,耐金属化溶融和耐焊接热试验方法
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
参考页数：44P.;A4
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装置内埋基板. 指南. 电气试验
Device embedded substrate. Guidelines. Electrical testing
参考页数：20P.;A4
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装置嵌入基体. 指南. 数据格式
Device embedded substrate. Guidelines. Data format
参考页数：42P.;A4
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抑制无线电干扰用整套滤波装置.空白详细规范.抑制电磁干扰用无源过滤装置.要求安全试验的过滤器(只用于安全试验)
Complete filter units for radio interference suppression-Part 2-2:Blank detail specification-Passive filter units for electromagnetic interference suppression-Filters for which safety tests are required (safety tests only)
参考页数：15P.;A4
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电子组装技术.电子模块
Electronics assembly technology. Electronic modules
参考页数：20P.;A4
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可靠性应力筛分.第1部分:批制造的可修复组件
Reliability stress screening - Part 1: Repairable assemblies manufactured in lots
参考页数：84P.;A4
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钎焊电子组件的工艺要求.总则
Workmanship requirements for soldered electronic assemblies - General
参考页数：78P.;A4
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钎焊电子组装件的工艺要求.钎焊电子组装件的再加工、改进和维修
Workmanship requirements for soldered electric assemblies - Rework, modification and repair of soldered electronic assemblies
参考页数：42P.;A4
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