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电子装配技术.焊缝用环境和耐久性试验方法的选择指南
Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints
参考页数:47P;A4
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研制电子设备机械构件用模块排序.第2部分:25 mm设备接口配合尺寸规格的实施规程
Modular order for the development of mechanical structures for electronic equipment practices - Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice
参考页数:24P;A4
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电子组件用连接材料.电子焊接用电子级钎焊合金及有焊剂和无焊剂的固体焊料用要求
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
参考页数:40P.;A4
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表面安装技术.通孔回流(THR)焊接用组件规范的标准方法
Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering
参考页数:28P.;A4
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表面安装技术.表面安装焊点的环境忍受力试验方法.周期性挠曲试验
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Cyclic bending test
参考页数:18P.;A4
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使用条形码和二维符号的电子元器件的产品包装标签
Product package labels for electronic components using bar code and two- dimensional symbologies
参考页数:36P.;A4
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环境试验. 试验. 试验Te/Tc. 采用湿平衡(力值测量)法的电子元件和印制板焊接性试验
Environmental testing. Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
参考页数:58P.;A4
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使用熔融无铅焊料合金的波峰焊设备侵蚀试验方法. 第3部分: 侵蚀试验方法选择指南
Test method for erosion of wave soldering equipment using molten lead-free solder alloy. - Part 3: Selection guidance of erosion test methods
参考页数:36P.;A4
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使用熔融无铅焊料合金的波峰焊接设备腐蚀的试验方法. 表面处理金属材料的腐蚀试验方法
Test method for erosion of wave soldering equipment using molten lead-free solder alloy. Erosion test method for metal materials with surface processing
参考页数:22P.;A4
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装置内埋基板. 指南. 通用技术说明
Device embedded substrate. Guidelines. General description of technology
参考页数:34P.;A4
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