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环境试验. 第2-69部分: 试验. 试验Te/Tc: 用湿平衡(力测量)法对电子元件和印刷电路板进行可焊性试验(IEC 60068-2-69:2017/COR1:2018); 德文版本EN 60068-2-69:2017/AC:2018-03
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017/COR1:2018); German version EN 60068-2-69:2017/AC:2018-03
参考页数:6P.;A4
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印刷电路板组件.第2部分:分规范.表面安装焊接组件的要求(IEC 61191-2-2017); 德文版本EN 61191-2-2017
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017
参考页数:36P.;A4
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表面安装技术. 第4部分: 潮湿敏感器件的分类, 包装, 贴标和搬运.修改件1
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices; Amendment 1
参考页数:8P.;A4
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环境试验. 第2 - 69部分:测试. 测试Te / Tc :用润湿平衡(力测量)法测试电子元件和印刷电路板的可焊性:更正1
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method; Corrigendum 1
参考页数:6P.;A4
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表面安装技术. 第4部分: 潮湿敏感器件的分类, 包装, 贴标和搬运
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
参考页数:132P.;A4
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不锈钢波导法兰盘
Corrosion-resisting steel flanges for waveguide
参考页数:21P.;A4
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表面安装技术. 湿度敏感器件的分类, 包装, 标记和处理
Surface mounting technology. Classification, packaging, labelling and handling of moisture sensitive devices
参考页数:38P.;A4
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电子组装技术. 区域阵列类型包装表面安装设备的焊接接缝的耐久性试验方法
Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices
参考页数:48P.;A4
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装置嵌入基体. 总规格. 试验方法
Device embedded substrate. Generic specification. Test methods
参考页数:62P.;A4
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电子组装件用附件材料.电子组装件中高质量互联用焊剂的要求
Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
参考页数:26P.;A4
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