标准号: |
IEC 60068-2-69 CORR 1-2018 |
英文名称: |
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method; Corrigendum 1 |
中标分类: |
综合>>环境条件与通用试验方法 |
发布日期: |
2018-0101 |
发布单位: |
IX-IEC |
标准状态: |
请与本站工作人员进行确认 |
ICS分类: |
环境试验>>环境试验 |
起草单位/标准公告: |
IEC/TC 91 Montageverfahren für elektronische Baugruppen;IEC/TC 91 Electronics assembly technology;CEI/CE 91 |
正文语言: |
双语(英,法) |
原文名称: |
Essais d'environnement - Partie 2-69: Essais - Essai Te/Tc: Essai de brasabilité des composants électroniques et cartes imprimées par la méthode de la balance de mouillage (mesure de la force); Corrigendum 1 |
页数: |
6P.;A4 |
附注: |
History:IEC 60068-2-69 CORR 1-2018-01 |
内容提要(EN): |
Components;Electrical components;Electrical engineering;Electricity;Electronic engineering;Electronic equipment;Electronic equipment and components;Electrotechnical products;Environmental testing;Force;Materials testing;Methods;Preparation;Pretreatment;SMD;Solder bath method;Solderability;Solderability testing;Surface mounting;Surface mounting devices;Test equipment;Testing;Wetting balances;Procedures;Processes;Preconditioning |
归属: |
国际 |