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电子设备用连接元件.基本试验程序和测量方法.耐化学性能试验.抗液性
Connectors for electronic equipment - Tests and measurements - Chemical resistance tests - Fluid resistance
参考页数：12P;A4
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电气设备的机电元件.基本试验程序和测量方法.气候试验.试验11h.沙尘
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Climatic tests - Test 11h - Sand and dust
参考页数：10P.;A4
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电子设备用机电元件规范.基本试验规程和测量方法.第6部分:气候试验和钎焊试验
Specification for electromechanical components for electronic equipment: basic testing procedures and measuring methods - Climatic tests and soldering tests
参考页数：26P.;A4
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电子设备用连接器.试验和测量.流动混合气体腐蚀试验
Connectors for electronic equipment - Tests and measurements - Flowing mixed gas corrosion test
参考页数：10P.;A4
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电子设备用机电元件.基本试验程序和测量方法.动态应力试验.6e试验:随机振动.第5节:6e试验.随机振动
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Dynamic stress tests - Test 6e - Random vibration - Section 5: Test 6e: Random vibration
参考页数：10P;A4
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电子设备用机电元件.基本试验规程和测量方法.密封试验.试验14g:水冲击
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Sealing tests - Test 14g - Impacting water
参考页数：8P.;A4
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电气设备的机电元件.基本试验程序和测量方法.气候试验.试验11a.气候后果
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Climatic tests - Test 11a - Climatic sequence
参考页数：10P.;A4
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电信和电子设备变压器和感应器.线圈架主要尺寸.叠层铁芯线圈架
Transformers and inductors for use in telecommunication and electronic equipment - Main dimensions of coil formers - Coil formers for laminated cores
参考页数：30P.;A4
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半导体器件. 微型机电装置. 第25部分: 硅基MEMS制造技术. 微键合区拉压和剪切强度的测量方法(IEC 62047-25-2016); 德文版本EN 62047-25-2016
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
参考页数：23P.;A4
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半导体器件. 微型机电装置. 第16部分: 测定MEMS膜残余应力的试验方法. 晶片弯曲法和悬臂梁偏位法 (IEC 62047-16-2015); 德文版本EN 62047-16-2015
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015); German version EN 62047-16:2015
参考页数：13P.;A4
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