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混合集成电路用被釉钢基片
Porcelain enameled steel substrate for hybrid integrated circuits
参考页数:8P.;A4
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厚膜混合集成电路用铜导体浆料
Copper conductor paste for thick film hybrid integrated circuits
参考页数:9P.;A4
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厚膜混合集成电路多层布线用介质浆料
Dielectric paste for multilayer lay out of thick film hybrid integrated circuits
参考页数:8P.;A4
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微波集成电路用氧化铝陶瓷基片
Alumina ceramic substrates for microwave integrated circuits
参考页数:7P.;A4
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混合集成电路参数标准检定规程
Standard verification practice of parameters of hybrid integrated circuit
参考页数:
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薄膜集成电路和混合集成电路.合格鉴定批准程序
Film and hybrid integrated circuits - Procedure for qualification approval
参考页数:36P.;A4
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电子元器件质量评定协调体系.空白详细规范.集成调压器
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: integrated voltage regulators
参考页数:18P.;A4
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电子元器件用质量评估协调体系.一般规范:薄膜和混合式集成电路
Harmonized system of quality assessment for electronic components. Generic specification: film and hybrid integrated circuits
参考页数:80P.;A4
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薄膜集成电路和混合集成电路.通用规范:性能鉴定程序
Film and hybrid integrated circuits. Generic specification. Capability approval procedure
参考页数:70P;A4
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电子元器件质量评估协调体系规范.空白详细规范:集成电压比较器
Specification for harmonized system of quality assessment for electronic components - Blank detail specification: integrated voltage comparators
参考页数:30P.;A4
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