|
半导体设备.半导体传感器.压力传感器
Semiconductor devices - Semiconductor sensors - Pressure sensors
参考页数：24P;A4
|
|
|
|
|
|
半导体器件.第16-3部分:微波集成电路.变频器
Semiconductordevices —Part 16-3: Microwave integratedcircuits — Frequency converters
参考页数：44P.;A4
|
|
|
|
|
|
半导体装置.微机电装置.薄膜材料的轴向疲劳试验方法
Semiconductor devices - Micro-electromechanical devices - Axial fatigue testing methods of thin film materials
参考页数：20P.;A4
|
|
|
|
|
|
半导体器件.半导体传感器.传感器用一般规范
Semiconductor devices - Semiconductor sensors - Generic specification for sensors
参考页数：26P;A4
|
|
|
|
|
|
半导体器件.半导体传感器.PN-结点半导体温度传感器
Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
参考页数：22P;A4
|
|
|
|
|
|
发光二极管(LED)模块的交流或直流供电电子控制装置.性能要求
DC or AC supplied electronic control gear for LED modules - Performance requirements
参考页数：18P.;A4
|
|
|
|
|
|
半导体器件.能量收集和产生用半导体器件. - 第2部分:基于热电的热电能量采集
Semiconductor devices - Semiconductor devices for energy harvesting and generation. - Part 2: Thermo power based thermoelectric energy harvesting
参考页数：18P.;A4
|
|
|
|
|
|
半导体器件. 微型机电装置. 硅基MEMS制造技术. 微键合区拉压和剪切强度的测量方法
Semiconductor devices. Micro-electromechanical devices. Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
参考页数：28P.;A4
|
|
|
|
|
|
半导体器件. 收集和产生能量的半导体器件. 第3部分: 基于振动的电磁能量收集
Semiconductor devices - Semiconductor devices for energy harvesting and generation. - Part 3: Vibration based electromagnetic energy harvesting
参考页数：22P.;A4
|
|
|
|
|
|
半导体装置.微型电机装置.术语和定义
Semiconductor devices. Micro-electromechanical devices. Terms and definitions
参考页数：36P.;A4
|
|
|
|
|
