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电子组件用连接材料.第1-3部分:电子焊接设施用电子级钎焊合金及有焊剂和无焊剂的固体焊料的要求
Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications.
参考页数：44P.;A4
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应力筛分的可靠性.第1部分:批量生产可修复配件
Reliability stress screening - Part 1 : repairable assemblies manufactured in lots.
参考页数：85P.;A4
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电子设备操作规程的机械结构开发的模数等级.第2部分:分规范.25 mm 的设备操作规程接口配合尺寸
Modular order for the development of mechanical structures for electronic equipment practices. Part 2 : sectional specification. Interface co-ordination dimensions for the 25 mm equipment practice.
参考页数：20P.;A4
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电工材料、互连构件和组件的试验方法.第1部分:一般试验方法和方法论
Test methods for electrical materials, interconnection structures and assemblies. Part 1 : general test methods and methodology.
参考页数：22P.;A4
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钎焊电子组件的工艺要求.第1部分:总则
Workmanship requirements for soldered electronic assemblies - Part 1 : general.
参考页数：77P.;A4
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钎焊电子组件的工艺要求.第3部分:通孔安装组件
Workmanship requirements for soldered electronic assemblies - Part 3 : through-hole mount assemblies.
参考页数：49P.;A4
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钎焊电子组件的工艺要求.第4部分:终端组件
Workmanship requirements for soldered electronic assemblies - Part 4 : terminal assemblies.
参考页数：30P.;A4
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印制电路板和印制电路板组件.设计和使用.第5-6部分:附件(结合区/接头)考虑要素.四面带有J形引线的芯片载体
Printed boards and printed board assemblies - Design and use - Part 5-6 : attachment (land/joint) considerations - Chip carriers with J-leads on four sides.
参考页数：21P.;A4
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钎焊电子组件的工艺要求.第2部分:表面安装组件
Workmanship requirements for soldered electronic assemblies - Part 2 : surface-mount assemblies.
参考页数：67P.;A4
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电子组件用连接材料.第1-1部分:电子组件中高质量互连用焊剂的要求
Attachment materials for electronic assembly - Part 1-1 : Requirements for soldering fluxes for high-quality interconnections in electronics assembly.
参考页数：16P.;A4
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