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印制线路板和组件.设计和使用.常规要求.电子组件平整度
Printed boards and assemblies - Design and use - Generic requirements - Flatness considerations for electronic assemblies
参考页数：18P;A4
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电子组件用的连接材料.电子组件中的优质互连接器用软焊钎助熔剂的要求
Attachment materials for electronic assembly - Requirements for soldering fluxes for high-quality interconnections in electronics assembly
参考页数：26P.;A4
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电子元器件质量评定协调体系.分规范:经质量评定的微波模数电子器件.试验方法索引
Harmonized system of quality assessment for electronic components - Sectional specification - Microwave modular electronic units of assessed quality - Index of test methods
参考页数：88P.;A4
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印刷电路板和互连结构及附件用电气材料的试验方法.第1部分:一般试验方法和方法论
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods and methodology
参考页数：26P;A4
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研制电子设备机械构件用模块排序.25mm设备的接口配合尺寸分规范.第1节:机壳和支架尺寸
Modular order for the development of mechanical structures for electronic equipment practices - Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Detail specification - Dimensions for cabinets and racks
参考页数：18P.;A4
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研制电子设备机械构件用模块排序.25mm设备的接口配合尺寸分规范.第2节:辅助框架、底盘、底板、面板及插入件
Modular order for the development of mechanical structures for electronic equipment practices - Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units
参考页数：40P;A4
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电子元器件质量评定协调系统.空白详细规范:经过质量评定装有的印制电路板电子模块.性能认可
Harmonized system of quality assessment for electronic components - Blank detail specification: printed board assembly modular electronic units of assessed quality - Capability approval
参考页数：24P;A4
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钎焊电子组件的工艺要求.终端组件
Workmanship requirements for soldered electronic assemblies - Terminal assemblies
参考页数：34P;A4
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印制电路板及组件.设计和使用.一般要求.受控阻抗
Printed boards and assemblies - Design and use - Generic requirements - Generic requirements - Controlled impedance
参考页数：46P.;A4
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印制板和组件.设计和使用.附件条件.四面带有J形引线的片状载体
Printed boards and assemblies - Design and use - Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
参考页数：22P;A4
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