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电子设备用机电元件规范:基本试验程序和测量方法.冲击试验(非固定元件)、静负载试验(固定元件)、耐久性试验和过载试验
Specification for electromechanical components for electronic equipment: basic testing procedures and measuring methods - Impact tests (free components), static load tests (fixed components), endurance tests and overload tests
参考页数：24P;A4
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半导体设备.微型机电装置.MEMS结构用测量粘合强度的弯曲和切变型式试验方法
Semiconductor devices. Micro-electromechanical devices. Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
参考页数：18P;A4
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电子设备用连接器.试验和测量.静荷载试验(固定连接器).测试8c.启动杆稳健性
Connectors for electronic equipment. Tests and measurements. Static load tests (fixed connectors). Test 8c. Robustness of actuating lever
参考页数：12P.;A4
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半导体装置.微电子机械装置.MEMS的晶圆与晶圆结合强度测量
Semiconductor devices. Micro-electromechanical devices. Wafer to wafer bonding strength measurement for MEMS
参考页数：32P;A4
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关于有害物质限制的电气和电子产品评估用技术文件
Technical documentation for the assessment of electrical and electronic products with respect to the restriction of hazardous substances
参考页数：16P;A4
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半导体装置.微型电机装置.金属薄膜材料的成形极限测量方法
Semiconductor devices. Micro-electromechanical devices. Forming limit measuring method of metallic film materials
参考页数：22P;A4
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半导体装置.微型机电装置.使用MEMS结构的共振,薄膜材料的弯曲挠度试验方法
Semiconductor devices. Micro-electromechanical devices. Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
参考页数：34P;A4
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半导体装置.微电子机械装置.MEMS材料的微型柱压缩试验
Semiconductor devices. Micro-electromechanical devices. Micro-pillar compression test for MEMS materials
参考页数：18P;A4
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电子设备用连接器.试验和测量.电缆夹紧试验.测试17b.电缆夹阻挡电缆旋转
Connectors for electronic equipment. Tests and measurements. Cable clamping tests. Test 17b. Cable clamp resistance to cable rotation
参考页数：10P.;A4
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电子设备连接器.试验和测量.耐久试验.试验9d.触点固定系统及密封件的耐久性(维护,老化处理)
Connectors for electronic equipment. Tests and measurements. Endurance tests. Test 9d. Durability of contact retention system and seals (maintenance, ageing)
参考页数：10P.;A4
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