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电子元器件质量评定协调体系规范.空白详细规范:数字微处理机集成电路
Specification for harmonized system of quality assessment for electronic components - Blank detail specification: digital microprocessor integrated circuits
参考页数：34P.;A4
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识别卡系统.电讯.集成电路卡和终端.第4部分:独立使用的与终端要求有关的卡
Identification card systems - Telecommunications - Integrated circuit(s) cards and terminals - Application independent card related terminal requirements
参考页数：20P;A4
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半导体器件机械标准化.第5部分:集成电路胶带自动粘合推荐标准
Mechanical standardization of semiconductor devices - Recommendations applying to tape automated bonding (TAB) of integrated circuits
参考页数：38P.;A4
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模拟和数字电路仿真用JESSI 0.8m CMOS传输模式
JESSI 0.8m CMOS transistor model for analogue and digital circuit simulation
参考页数：42P.;A4
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欧洲微试验芯片特性测量技术
Measurement techniques for the characterization of the European mini test chip
参考页数：28P.;A4
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半导体器件. 微型机电装置. 第20部分: 陀螺仪 (IEC 62047-20-2014); 德文版本EN 62047-20-2014
Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (IEC 62047-20:2014); German version EN 62047-20:2014
参考页数：55P.;A4
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半导体器件. 微型机电装置. 第22部分: 柔性基板上导电薄膜机电拉伸试验方法 (IEC 62047-22-2014); 德文版本EN 62047-22-2014
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014
参考页数：11P.;A4
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半导体器件. 微型机电装置. 第21部分: 薄膜MEMS材料泊松比试验方法 (IEC 62047-21-2014); 德文版本EN 62047-21-2014
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (IEC 62047-21:2014); German version EN 62047-21:2014
参考页数：16P.;A4
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光学电路板.第1部分:概述(IEC 62496-1-2008).德文版本EN 62496-1-2009
Optical circuit boards - Part 1: General (IEC 62496-1:2008); German version EN 62496-1:2009
参考页数：25P.;A4
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总规范.分立的压力触点功率半导体装置(资格认可)
Generic specification: Discrete pressure contact power semiconductor devices (Qualification approval); German version EN 153000:1998
参考页数：22P.;A4
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