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半导体器件的机械标准化. 半导体器件包封装外形的编码系统和分类形式
Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages
参考页数：28P.;A4
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半导体器件. 微型机电装置. 微型机电装置用无需支撑物材料线性热膨胀系数试验方法
Semiconductor devices. Micro-electromechanical devices. Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
参考页数：24P;A4
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半导体器件.微型机电装置.薄膜材料的弯曲测试方法
Semiconductor devices. Micro-electromechanical devices. Bend testing methods of thin film materials
参考页数：18P;A4
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半导体装置.微电子机械装置.射频微机电转换器
Semiconductor devices. Micro-electromechanical devices. RF MEMS switches
参考页数：38P;A4
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半导体器件.机械和气候试验方法.静电放电(ESD)灵敏度测试.机器模型(MM)
Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
参考页数：16P;A4
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半导体设备.分立器件.绝缘的功率半导体器件
Semiconductor devices. Discrete devices. Isolated power semiconductor devices
参考页数：30P;A4
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半导体设备.微型机电装置.MEMS结构用测量粘合强度的弯曲和切变型式试验方法
Semiconductor devices. Micro-electromechanical devices. Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
参考页数：18P;A4
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半导体装置.微电子机械装置.MEMS的晶圆与晶圆结合强度测量
Semiconductor devices. Micro-electromechanical devices. Wafer to wafer bonding strength measurement for MEMS
参考页数：32P;A4
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半导体装置.微型电机装置.金属薄膜材料的成形极限测量方法
Semiconductor devices. Micro-electromechanical devices. Forming limit measuring method of metallic film materials
参考页数：22P;A4
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半导体元件.分立元件.基本和增强隔离用磁性和电容耦合器
Semiconductor devices. Discrete devices. Magnetic and capacitive coupler for basic and reinforced isolation
参考页数：44P;A4
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