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半导体器件. 第16-5部分: 微波集成电路. 振荡器(IEC 60747-16-5-2013); 德文版本EN 60747-16-5-2013
Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 60747-16-5:2013); German version EN 60747-16-5:2013
参考页数:41P;A4
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电力电子转换器系统和设备的安全性要求.第1部分:总论(IEC 62477-1-2012).德文版本EN 62477-1-2012
Safety requirements for power electronic converter systems and equipment - Part 1: General (IEC 62477-1:2012); German version EN 62477-1:2012
参考页数:191P.;A4
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半导体器件.第16-4部分:微波集成电路.开关(IEC 60747-16-4-2004 + A1-2009).德文版本EN 60747-16-4-2004 + A1-2011
Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (IEC 60747-16-4:2004 + A1:2009); German version EN 60747-16-4:2004 + A1:2011
参考页数:30P.;A4
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半导体器件.第16-1部分:微波集成电路.放大器
Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers (IEC 60747-16-1:2001 + A1:2007); German version EN 60747-16-1:2002 + A1:2007
参考页数:58P.;A4
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电离辐射半导体探测器用放大器和前置放大器的试验程序
Standard Test Procedures for Amplifiers and Preamplifiers Used with Detectors of Ionizing Radiation
参考页数:59P.;A4
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半导体器件. 微型机电装置. 第16部分: 测定MEMS膜残余应力的试验方法. 晶片弯曲法和悬臂梁偏位法
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
参考页数:21P.;A4
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半导体器件. 微型机电装置. 第15部分: PDMS和玻璃之间粘结强度的试验方法
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
参考页数:21P.;A4
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半导体器件. 微型机电装置. 第17部分: 测量薄膜机械性能的膨胀试验方法
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
参考页数:54P.;A4
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半导体器件. 微型机电器件. 第29部分:室温下独立式导电薄膜机电松弛试验方法
Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin films under room temperature
参考页数:12P.;A4
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普通照明用LED模块.安全性规范
LED modules for general lighting - Safety specifications
参考页数:87P.;A4
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