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半导体压模产品.第3部分:搬运、包装和储存的良好规范建议
Semiconductor dieproducts —Part 3: Recommendations for goodpractice in handling, packing andstorage
参考页数：48P.;A4
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半导体器件.微波集成电路.放大器
Semiconductordevices —Part 16-1: Microwave integratedcircuits — Amplifiers
参考页数：60P.;A4
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半导体器件.微型机电器件.薄膜材料的拉伸试验方法
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
参考页数：16P.;A4
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分立的半导体器件和集成电路.微波集成电路.放大器
Discrete semiconductor devices and integrated circuits - Microwave integrated circuits - Amplifiers
参考页数：48P.;A4
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电子元器件用质量评估协调体系.一般规范.分立式半导体器件
Harmonized system of quality assessment for electronic components - Generic specification: discrete semiconductor devices
参考页数：154P.;A4
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半导体装置.微波集成电路.转换器
Semiconductor devices. Microwave integrated circuits. Switches
参考页数：34P.;A4
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分立半导体器件和集成电路.半导体器件.半导体传感器.霍尔元件
Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
参考页数：18P.;A4
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电子元器件质量评估协调体系.一般规范:分立式半导体器件.CECC评定程序平均值
Harmonized system of quality assessment for electronic components - Generic specification: discrete semiconductor devices - CECC assessed process average
参考页数：8P;A4
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半导体器件. 微型机电装置. 第25部分: 硅基MEMS制造技术. 微键合区拉压和剪切强度的测量方法(IEC 62047-25-2016); 德文版本EN 62047-25-2016
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
参考页数：23P.;A4
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电力电子转换器系统和设备的安全性要求.第1部分:总论(IEC 62477-1-2012).德文版本EN 62477-1-2012/A11-2014
Safety requirements for power electronic converter systems and equipment - Part 1: General; German version EN 62477-1:2012/A11:2014
参考页数：4P.;A4
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