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电工词汇.第581章:电子设备用电机元件
Electrotechnical vocabulary. Chapter 581 : electromechanical components for electronic equipment.
参考页数：34P.;A4
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WEEE的回收, 物流以及处理要求. 第1部分: 通用处理要求
Collection, logistic and treatment requirements for WEEE - Part 1 : general treatment requirements
参考页数：43P.;A4
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半导体装置.微电机装置.第14部分:金属薄膜材料的成形极限测量方法
Semiconductor devices - Micro-electromechanical devices - Part 14: forming limit measuring method of metallic film materials
参考页数：21P;A4
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关于有害物质限制的电气和电子产品评估用技术文件
Technical documentation for the assessment of electrical and electronic products with respect to the restriction of hazardous substances
参考页数：17P;A4
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半导体器件.微电机装置.第5部分:射频(RF)微电子机械系统(MEMS)开关
Semiconductor devices - Micro-electromechanical devices - Part 5 : RF MEMS switches.
参考页数：39P;A4
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半导体装置.微机电装置.第8部分:用钢带弯曲试验法测量薄膜的拉伸性能.
Semiconductor devices - Micro-electromechanical devices - Part 8 : strip bending test method for tensile property measurement of thin films.
参考页数：21P;A4
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半导体装置.微电机装置.第6部分:薄膜材料的轴向疲劳试验方法.
Semiconductor devices - Micro-electromechanical devices - Part 6 : axial fatigue testing methods of thin film materials.
参考页数：19P;A4
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半导体器件 - 微型机电装置 - 第9部分: 微机电系统硅片的硅片键合强度测试.
Semiconductor devices - Micro-electromechanical devices - Part 9 : wafer to wafer bonding strength measurement for MEMS.
参考页数：29P;A4
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半导体装置.微机电装置.第13部分:测量MEMS结构粘接强度的折弯和剪切试验方法
Semiconductor devices - Micro-electromechanical devices - Part 13: bend- and shear- type test methods of measuring adhesive strenght for MEMS structures
参考页数：21P;A4
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半导体器件 - 微型机电装置 - 第12部分: 使用MEMS结构共振的薄膜材料的弯曲疲劳测试方法.
Semiconductor devices - Micro-electromechanical devices - Part 12 : bending fatigue testing method of thin film materials using resonant vibration of MEMS structures.
参考页数：35P;A4
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