|
半导体器件. 微型机电装置. 陀螺仪
Semiconductor devices. Micro-electromechanical devices. Gyroscopes
参考页数：56P.;A4
|
|
|
|
|
|
半导体器件. 微型机电装置. 微槽和针孔结构的描述和测量方法
Semiconductor devices. Micro-electromechanical devices. Description and measurement methods for micro trench and needle structures
参考页数：34P.;A4
|
|
|
|
|
|
半导体装置.微波集成电路.振荡器
Semiconductor devices. Microwave integrated circuits. Oscillators
参考页数：44P;A4
|
|
|
|
|
|
电力电子转换器系统和设备的安全性要求.总论
Safety requirements for power electronic converter systems and equipment. General
参考页数：190P;A4
|
|
|
|
|
|
半导体装置.微电机装置.薄膜拉伸性能测量用带材弯曲试验方法
Semiconductor devices. Micro-electromechanical devices. Strip bending test method for tensile property measurement of thin films
参考页数：22P.;A4
|
|
|
|
|
|
半导体压模制品.交换数据格式.
Semiconductor die products. Exchange data formats
参考页数：74P.;A4
|
|
|
|
|
|
半导体器件.分立器件.半导体加速器
Semiconductor devices. Discrete devices. Semiconductor accelerometers
参考页数：102P;A4
|
|
|
|
|
|
半导体器件. 微机电设备. MEMS压电薄膜机电转换特性的测量方法
Semiconductor devices. Micro-electromechanical devices. Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
参考页数：22P.;A4
|
|
|
|
|
|
半导体装置.微电机装置.微电子机械系统(MEMS)一般规格
Semiconductor devices. Micro-electromechanical devices. Generic specification for MEMS
参考页数：24P.;A4
|
|
|
|
|
|
半导体压模产品.采购和使用
Semiconductor die products. Procurement and use
参考页数：48P;A4
|
|
|
|
|
