标准号: |
IEC 61190-1-2-2014 |
英文名称: |
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly |
中标分类: |
电子元器件与信息技术>>连接器 |
发布日期: |
2014-02 |
发布单位: |
IX-IEC |
标准状态: |
请与本站工作人员进行确认 |
ICS分类: |
钎焊和低温焊>>钎焊和低温焊 |
起草单位/标准公告: |
IEC/TC 91 |
正文语言: |
双语(英,法) |
原文名称: |
Verbindungsmaterialien fur Baugruppen der Elektronik.Teil 1-2: Anforderungen an Lotpaste fur hochwertige Verbindungen in der Elektronikmontage |
页数: |
50P.;A4 |
附注: |
History:IEC 61190-1-2 (2014-02);IEC 91/1154A/FDIS (2013-12);IEC 91/1154/FDIS (2013-11);IEC 91/1043/CDV (2012-06);IEC 91/1023/CD (2011-12);IEC 61190-1-2 (2007-04);IEC 91/646/FDIS (2007-02);IEC 91/567/CDV (2005-11);IEC 61190-1-2 (2002-03);IEC 91/278/FDIS (2001-12);IEC 91/191/CDV (2000-05) |
被代替标准: |
IEC 91/1154A/FDIS-2013;IEC 61190-1-2-2007 |
引用标准: |
IEC 60194-2006;IEC 61189-5-3;IEC 61190-1-1-2002;IEC 61190-1-3-2007;ISO 9454-2-1998 |
采用关系: |
BS EN 61190-1-2-2014,IDT;EN 61190-1-2-2014,IDT;NEN-EN-IEC 61190-1-2 en-2014,IDT |
内容提要(EN): |
Alloys;Assemblies;Chemical composition;Connection technology;Definitions;Electrical engineering;Electronic engineering;Electronic equipment and components;Erecting (construction operation);Fillers;Fluxes;Fluxes (materials);Form of delivery;Inspection;Paste solder;Pastes;Quality;Quality assurance;Shape;Soft solders;Soldering pastes;Solders;Sounding heads;Specification (approval);Testing;Tin-containing alloys;Welding engineering |
内容提要(QT): |
Anforderung;Baugruppe;Begriffe;chemische Zusammensetzung;Definition;Elektronik;elektronisches Bauelement;Elektrotechnik;Flussmittel;Fluxmittel;Form;Fullmaterial;Legierung;Lieferform;Lotmittel;Lotpaste;Lot;Lotpaste;Montage;Paste;Prufung;Qualitat;Qualitatsprufung;Qualitatssicherung;Schweistechnik;Verbindungstechnik;Weichlot;zinnhaltige Legierung |
归属: |
国际 |