标准号: |
BS EN 60191-6-22-2013 |
英文名称: |
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) |
中标分类: |
电子元器件与信息技术>>半导体分立器件综合 |
发布日期: |
2013-04-30 |
发布单位: |
GB-BSI |
标准状态: |
请与本站工作人员进行确认 |
实施日期: |
2013-04-30 |
ICS分类: |
电气和电子工程制图>>电气和电子工程制图 |
起草单位/标准公告: |
BSI |
正文语言: |
英语 |
页数: |
20P;A4 |
采用关系: |
EN 60191-6-22-2013,IDT;IEC 60191-6-22-2012,IDT |
内容提要(EN): |
Ball Grid Array;Case drawing;Components;Connecting dimensions;Definitions;Dimensions;Drawings;Electric enclosures;Electrical engineering;Electronic engineering;Electronic equipment and components;Enclosures;Engineering drawings;Grid systems;Integrated circuits;Land Grid Array;Marking;Measurement;Measuring techniques;Mechanic;Numbering;Semiconductor devices;Semiconductor package;Semiconductors;SMD;Surface mounting;Surface mounting devices;Symbols;Types |
归属: |
英国 |