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半导体器件. 微型机电装置. 第22部分: 柔性基板上导电薄膜机电拉伸试验方法
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
参考页数：20P.;A4
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半导体器件. 微型机电装置. 第21部分: 薄膜MEMS材料泊松比试验方法
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
参考页数：26P.;A4
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普通照明用LED模块.安全性规范
LED modules for general lighting - Safety specifications; Amendment 2
参考页数：8P.;A4
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半导体器件.微型机电装置.第11部分:微型机电装置用无需支撑物材料线性热膨胀系数试验方法
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
参考页数：38P;A4
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半导体器件.微型机电器件.第18部分:薄膜材料的弯曲测试方法
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
参考页数：26P;A4
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半导体器件.微型机电装置.第19部分:电子罗盘
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
参考页数：60P;A4
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半导体器件. 第16-5部分: 微波集成电路. 振荡器
Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
参考页数：85P;A4
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半导体压模产品.第4部分:压模用户和供应商调查表
Semiconductor die products - Part 4: Questionnaire for die users and suppliers
参考页数：37P;A4
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电力电子转换器系统和设备用安全性要求.第1部分:总则
Safety requirements for power electronic converter systems and equipment - Part 1: General
参考页数：376P;A4
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半导体器件.微电机器件.第12部分:使用MEMS结构共振的薄膜材料的弯曲疲劳测试方法
Semiconductor devices - Microelectromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
参考页数：59P;A4
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