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半导体器件.微电子机械器件.第10部分:MEMES材料微极压缩测试
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
参考页数：22P;A4
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半导体装置.微电机装置.第14部分:金属薄膜材料的成型极限测量方法
Semiconductor devices - Microelectromechanical devices - Part 14: Forming limit measuring method of metallic film materials
参考页数：38P;A4
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半导体装置.微机电装置.第13部分:测量MEMS结构粘接强度的折弯和剪切试验方法
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear-type test methods of measuring adhesive strength for MEMS structures
参考页数：34P;A4
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半导体器件. 微型机电器件. 第30部分:MEMS压电薄膜机电转换特性的测量方法
Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
参考页数：20P.;A4
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半导体器件.微电机装置.第5部分:射频(RF)微电子机械系统(MEMS)开关
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
参考页数：69P;A4
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半导体器件.微型机电器件.第9部分:微机电系统硅片的硅片键合强度测试
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
参考页数：49P;A4
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半导体器件.分立器件.第15部分:单独的电力半导体器件
Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
参考页数：54P.;A4
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半导体器件.第16-4部分:微波集成电路.开关
Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
参考页数：32P.;A4
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发光二极管(LED)模块用直流或交流电源电子控制装置.性能要求
DC or AC supplied electronic control gear for LED modules - Performance requirements
参考页数：30P;A4
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半导体压模产品.第3部分:搬运、包装和储存的良好实施推荐规程
Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
参考页数：114P.;A4
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